http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015014028-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6bd0cdbc5c67cf4957ed83c89140748e
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
filingDate 2013-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41ca93b15714c23133eec10dd20f38e3
publicationDate 2015-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015014028-A
titleOfInvention Surface treatment method for resin film and method for producing copper clad laminate including the same
abstract PROBLEM TO BE SOLVED: To provide a pretreatment method capable of increasing the adhesion between a resin film and a metal film without reducing the heat-resistant peel strength. A surface treatment method applied to a resin film under a reduced-pressure atmosphere as typified by a pretreatment of a film formation process by a dry plating method such as a sputtering method, and preferably a length that is conveyed by roll-to-roll. After excessively irradiating at least one surface of the long resin film with plasma, the surface irradiated with plasma is irradiated with an ion beam. The plasma treatment atmosphere and the ion beam treatment atmosphere are preferably different from each other. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018135542-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7172335-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7043731-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020045524-A
priorityDate 2013-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005054259-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H116061-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010247417-A
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Total number of triples: 24.