http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015012069-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c20dac5f1a44475c96d2db944e79786 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
| filingDate | 2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90c129aa5bf78308300568feac494342 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b55fa372d9f8ec1f8a899a65e6da9a0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5609b796e84e3f383135e4d3afb77c07 |
| publicationDate | 2015-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015012069-A |
| titleOfInvention | Resin composition for die attach |
| abstract | Disclosed is a die attach resin composition that has good workability, can provide sufficient adhesive strength after curing, and can solve the problem of warping of a substrate or the like due to curing shrinkage. A glass containing (A) a thermosetting resin, (B) a curing agent, (C) thermoplastic resin particles, and (D) an inorganic filler, wherein the thermoplastic resin of (C) is -60 to 30 ° C. Resin for die attach having a transition point and a melting point of 90 to 160 ° C., and (C) is 0.5 to 9 parts by mass with respect to a total of 100 parts by mass of (A) to (D) A composition, a semiconductor device using the composition, and a method for manufacturing the semiconductor device. The thermoplastic resin particles (C) are polyester resin particles, polyolefin resin particles, and polyacetal resin particles having an average particle diameter of 8 to 50 μm. The thermosetting resin (A) includes an epoxy resin and a (meth) acrylic resin. The curing agent (B) contains a phenolic resin curing agent. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017171724-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7303963-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023032700-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023157838-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11609360-B2 |
| priorityDate | 2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 244.