Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F7-18 |
filingDate |
2013-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d153067fd6a06eb764302ad0414bc3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4005be51c86bf529d7dce7c5d1fcf1b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd2075c3b0834cb8cc0069555e0195e6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e6ee4e9bbc1ad19d63b291a0e682cea |
publicationDate |
2015-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2015006783-A |
titleOfInvention |
Metal-resin bonding structure and manufacturing method thereof, and circuit board and copper-clad laminate having the metal-resin bonding structure |
abstract |
The present invention relates to a metal-resin bonded structure. A metal-resin bonding structure according to an embodiment of the present invention is provided on a resin layer, a metal layer bonded to the resin layer, and a bonding surface between the resin layer and the metal layer. And a modified layer containing a silane-based coupling agent to provide a bonding force between them. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016186047-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018201814-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10669457-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018111788-A |
priorityDate |
2013-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |