http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015006783-A

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filingDate 2013-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d153067fd6a06eb764302ad0414bc3b
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publicationDate 2015-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2015006783-A
titleOfInvention Metal-resin bonding structure and manufacturing method thereof, and circuit board and copper-clad laminate having the metal-resin bonding structure
abstract The present invention relates to a metal-resin bonded structure. A metal-resin bonding structure according to an embodiment of the present invention is provided on a resin layer, a metal layer bonded to the resin layer, and a bonding surface between the resin layer and the metal layer. And a modified layer containing a silane-based coupling agent to provide a bonding force between them. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016186047-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018201814-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10669457-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018111788-A
priorityDate 2013-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 31.