| abstract |
An anisotropic conductive paste having sufficient adhesive strength, insulation and moisture resistance even when the temperature during thermocompression bonding is low (for example, 180 ° C. or lower). An anisotropic conductive paste of the present invention comprises (A) a thermoplastic resin, (B) a (meth) acrylate reactive diluent having one unsaturated double bond in one molecule, C) a radical polymerization initiator, (D) an activator having one or more carboxyl groups in one molecule, (E) solder powder, (F) an organic filler, and (G) a silane coupling agent. And (G) the silane coupling agent is a silane coupling agent having at least one group selected from the group consisting of a vinyl group, a styryl group, a methacryl group, an acrylic group, and an amino group. To do. [Selection figure] None |