http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015000888-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2013-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad920a0e3f766a86f147538baf1449f4 |
| publicationDate | 2015-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2015000888-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | The present invention provides an epoxy resin composition for semiconductor encapsulation capable of improving the adhesion at the interface of a lead frame and reducing the elastic modulus, and a semiconductor device using the same. In an epoxy resin composition for semiconductor encapsulation, which contains an epoxy resin, a curing agent, and an inorganic filler as essential components and is used as a molding material for sealing a semiconductor mounted on a lead frame, an acrylic resin It contains a low stress agent having a hydroxyl group equivalent of 4000 to 6000 g / eq obtained by grafting a hydroxyl group. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019087463-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111194335-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019087463-A1 |
| priorityDate | 2013-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 89.