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filingDate 2012-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2014-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2014533775-A
titleOfInvention Metal structure embedded in ceramic substrate
abstract The present invention relates to a method of manufacturing a substrate with an embedded conductive metal structure or metallization, particularly for use as a printed circuit board. In addition to two-dimensional flat and planar substrates, three-dimensional or curved or angular substrates can also be metallized with deep bottoms. The present invention proposes to engrave grooves and / or notches in the substrate by laser technology and then form metal structures in these grooves and / or notches.
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