http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014533438-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0145 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00293 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate | 2012-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014533438-A |
| titleOfInvention | Method and apparatus for wafer level solder hermetic encapsulation of MEMS devices |
| abstract | A plurality of MEMS devices are formed on the substrate, a sacrificial layer is formed over each of the MEMS devices, and a protective cap layer is formed on the sacrificial layer. A release hole is formed through the protective cap layer to the underlying sacrificial layer, and a release agent is introduced through the release hole to remove the sacrificial layer below the protective cap layer and expose the MEMS device. The release hole is solder sealed to form a hermetic seal for the MEMS device. A method for hermetically sealing the release hole includes forming a wetting surface on a region adjacent to the opening and making the wetting surface viscous to draw a portion of solder to cover and seal the opening. Dipping in solder. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016539015-A |
| priorityDate | 2011-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.