http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014533000-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
| filingDate | 2012-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014533000-A |
| titleOfInvention | Low dielectric constant dielectric protective spacer for forming through-substrate via pattern in low dielectric constant wiring layer |
| abstract | A low dielectric constant dielectric protective spacer is provided for forming a through-substrate via (TSV) pattern in a low dielectric constant wiring layer. A method of forming a low dielectric constant dielectric protective spacer includes forming via openings in the low dielectric constant dielectric interconnect layer by etching. A protective layer is deposited in the via opening and on the low dielectric constant dielectric interconnect layer. At least a portion of the protective layer is etched away from the bottom of the via opening and the horizontal plane of the low dielectric constant dielectric interconnect layer. This etching leaves a protective sidewall spacer on the sidewall of the via opening. A through-substrate via is formed by etching in the bottom of the via opening and the semiconductor substrate. Fill the through-substrate via with a conductive material. |
| priorityDate | 2011-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.