| abstract |
The present invention relates to a device (1) for metallizing a wafer (11), in particular a microchip wafer, in an electrolyte, said device comprising a plurality of holding devices (3), each holding device (3) comprising: As an anode combined with each wafer (11), an electrolyte chamber (27) separated from the electrolyte receiving chamber (27) of the other holding device (3), a ring (15) acting as a cathode, and An anode system (29). [Selection] Figure 2 |