http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014504652-A
Outgoing Links
Predicate | Object |
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classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1071 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1032 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
filingDate | 2011-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2014-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2014504652-A |
titleOfInvention | Fusible polyimide molding compound and method for preparing the same |
abstract | The present invention provides a method for preparing a fusible polyimide molding compound, which includes the following steps: (Step 1) Preparation of a polyamic acid solution: 2, 3, 3 ′, 4 ′ -ODPA and oxydianiline are introduced into an aprotic polar solution at an equimolar ratio, and both substances are reacted at room temperature for 3 to 5 hours to prepare a polyamic acid solution; (Step 2) Chemical imidization: To 100 parts by weight of the polyamic acid solution, 40 to 160 parts by weight of a dehydrating agent and 5 to 50 parts by weight of a tertiary amine organic alkali catalyst are added together with a polyamide precipitating agent such as nonpolar arene, and 0.5 to 2 hours. Stir at high speed to complete chemical imidation; prepare a polyamide molding powder via filtration. Compared to s-polyamide, a-polyamide can lower the molding temperature by 70 ° C, the mechanical properties of a-polyamide at 220 ° C are superior to s-polyamide, and a-polyamide is soluble and fusible. . |
priorityDate | 2010-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.