| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 |
| filingDate |
2013-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac4ef1fa19d5880f281b6d2eb39f11db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4832c29ddc709d37831d79008cc6b24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_285883e27d75ced51105c333c871e3f9 |
| publicationDate |
2014-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2014234500-A |
| titleOfInvention |
Adhesive material for semiconductor manufacturing process |
| abstract |
The present invention relates to a pressure-sensitive adhesive material for a semiconductor manufacturing process used for the purpose of fixing and protecting a wafer constituting an element in a process of manufacturing a semiconductor. Conventional pressure-sensitive adhesive materials have problems such as warping or damage of the semiconductor wafer due to dimensional changes of the pressure-sensitive adhesive material in the manufacturing process, particularly at high temperatures. A sheet obtained by impregnating a glass fiber (B) with a curable resin (A) is used as a base material for an adhesive material. The base material has high dimensional stability and can suppress warpage of the semiconductor wafer during the process. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-4043419-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11767287-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7298798-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2021117760-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113165350-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220047880-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7016485-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102428497-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022264994-A1 |
| priorityDate |
2013-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |