| abstract |
PROBLEM TO BE SOLVED: To provide a porous resin molded article having excellent heat resistance, a fine cell structure and low dielectric constant, and a method for producing the same. A further object of the present invention is to provide a porous substrate having a metal foil on one side and being extremely useful as a circuit board for electronic equipment. The present invention provides a porous material having bubbles having an average bubble diameter of 5 μm or less, a porosity of 40% or more, and a relative dielectric constant at a frequency of 1 GHz of 2.00 or less. A resin molded body is provided. [Selection figure] None |