| abstract |
An object of the present invention is to provide a resin composition that provides a cured film excellent in curability, flexibility, toughness, and electrical reliability. [Solution] There is a need for an epoxy resin (a) having at least two epoxy groups in one molecule and a compound (b) having one or more polymerizable ethylenically unsaturated groups and one or more carboxyl groups in one molecule. Accordingly, a method for producing a reactive epoxycarboxylate compound (A) in which a compound (c) having at least two hydroxyl groups and one or more carboxyl groups in one molecule is reacted in the presence of trimethylglycine, and at least in one molecule An epoxy resin (a) having two or more epoxy groups, a compound (b) having one or more polymerizable ethylenically unsaturated groups and one or more carboxyl groups in one molecule, and at least in one molecule Reactive epoxy carboxylate in which compound (c) having two or more hydroxyl groups and one or more carboxyl groups is reacted in the presence of trimethylglycine Process for the preparation of a compound (A '). [Selection figure] None |