http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014208480-A

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filingDate 2014-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2014-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2014208480-A
titleOfInvention Copper foil with carrier, printed wiring board, printed circuit board, copper-clad laminate and printed wiring board manufacturing method
abstract The present invention provides a copper foil with a carrier, which is excellent in laser holeability of an ultrathin copper layer and is suitable for manufacturing a high-density integrated circuit board. [Solution] A copper foil with a carrier provided with a carrier, an intermediate layer, and an ultrathin copper layer in this order. After heating the copper foil with a carrier at 220 ° C. for 2 hours, the ultrathin copper according to JIS C 6471 When the layer is peeled off, the surface roughness Rz on the intermediate layer side of the ultrathin copper layer measured using a stylus-type roughness meter according to JIS B0601-1982 is 0.8 μm or more and less than 2.0 μm. And the copper foil with a carrier whose standard deviation of surface roughness Rz is 0.62 micrometer or less. [Selection figure] None
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