| abstract |
The present invention provides a polyesterimide resin composition having excellent heat resistance, flexibility, low hygroscopicity, and sufficient colorless transparency, and a film made using the same. A polyesterimide resin containing a structure represented by the following general formula (1) in a structural unit. [Chemical 1] (In the general formula (1), R1 represents a compound having a specific structure, and R2 represents a divalent chain aliphatic group, a divalent cycloaliphatic group or a divalent aromatic group.) [Selection figure] None |