| abstract |
[PROBLEMS] To provide a curable composition that is excellent in heat resistance and light resistance, has low oxygen and moisture permeability, and is useful as an encapsulant for electric / electronic materials, particularly light-emitting elements. A group represented by general formula (1) or a group represented by general formula (1) and a group represented by general formula (2) is any one of general formulas (3) to (7). A siloxane compound linked by a residue obtained by removing a vinyl group from the represented compound, a siloxane compound represented by the general formula (8) as the component (B), and a hydrosilylation catalyst as the component (C), (B) Curable composition whose content of a component is 10 mass% or more. General formulas (1) to (8) are as described in this specification. [Selection figure] None |