http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014204023-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 |
| filingDate | 2013-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58bf144d95f450b087e47cc969f93afe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7f25ae21d3282ee91ab3893ffa14ee7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3099d4153d812bc314912c50c9a111d5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10bc51e54cc0b555cb3f0d213458f3e1 |
| publicationDate | 2014-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014204023-A |
| titleOfInvention | Manufacturing method of structure having conductor wiring, structure having conductor wiring manufactured by the method, thermosetting resin composition, resin film, photosensitive resin composition, and dry film resist |
| abstract | Provided is a method for sufficiently efficiently manufacturing a structure (eg, a printed wiring board) having a conductive wiring having a fine opening in an insulating layer and excellent reliability. A first photosensitive resin layer forming step of forming a first photosensitive resin layer on a support so as to cover first conductor wirings 2a and 2b, and exposure to the first photosensitive resin layer A first patterning step of patterning by performing a treatment and a development process, and a thermosetting resin layer formation for forming the thermosetting resin layer 4 on the support so as to cover the pattern of the first photosensitive resin layer A step, a step of removing at least a part of a predetermined portion of the pattern of the thermosetting resin layer 4 and the first photosensitive resin layer by a laser, and a first photosensitive material exposed from the thermosetting resin layer 4. The manufacturing method of a structure which has a conductor wiring provided with the opening formation process which removes the property resin layer and forms the opening 4h which exposes the 1st conductor wiring 2a, 2b in the thermosetting resin layer 4. FIG. [Selection] Figure 6 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022265030-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017032828-A |
| priorityDate | 2013-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 316.