| abstract |
An Ag-Pd-Pt ternary alloy or an Ag-Pd-Pt ternary alloy bonding wire for a high-speed signal line capable of transmitting a stable ultra-high frequency signal of several GHz band or the like is provided. A ternary alloy composed of 0.8 to 2.5% by mass of palladium, 0.1 to 0.7% by mass of platinum, and the balance of 99.99% by mass or more of the silver, or this ternary alloy. It is a ternary alloy to which trace elements are added, and the cross section of the bonding wire is composed of a surface film and a core material, and the surface film of the silver alloy has a surface segregation layer with a high concentration of silver. A high-speed bonding wire for high-speed signal lines. [Effect] Even if an unstable silver sulfide layer is formed on the surface of the bonding wire due to the high concentration surface segregation layer of silver and the sulfidation resistance of the silver alloy, a strong silver sulfide (Ag2S) film is not formed and the surface An ultrahigh frequency signal such as several GHz can be sent by the high-purity silver layer segregated. [Selection] Figure 1 |