| abstract |
When a mounted product obtained by mounting a chip component on a circuit board using an anisotropic conductive adhesive is heated, conduction reliability is ensured and adhesion between them is ensured. Provision of a cured anisotropic conductive adhesive that can be secured. An anisotropic conductive adhesive in which conductive particles are dispersed in an epoxy adhesive containing a specific component of an epoxy compound and a curing agent in a specific blending ratio. The elastic modulus of each of the cured product at 35 ° C., 55 ° C., 95 ° C. and 150 ° C. is defined as EM 35 , EM 55 , EM 95 and EM 150 . An anisotropic conductive adhesive satisfying the formulas (1) to (5) when the elastic modulus change rate between them is ΔEM 55-95 and ΔEM 95-150 . 700 MPa ≦ EM 35 ≦ 3000 MPa (1) EM 150 <EM 95 <EM 55 <EM 35 (2) ΔEM 55-95 <ΔEM 95-150 (3) 20% ≦ ΔEM 55-95 (4) 40% ≦ ΔEM 95 -150 (5) [Selection] Figure 1 |