http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014172983-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_de498babb0c04a00ceb653738877b147 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-521 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2013-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e1dbabb693cf2284e636d034790b876 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a32d20bc7e5c9e99cab74813c1ad69af http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab7602f3e8d327de7be22f40f8cf2c40 |
| publicationDate | 2014-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014172983-A |
| titleOfInvention | Prepreg and copper-clad substrate using this as an insulating layer |
| abstract | It is suitable for a copper-clad substrate that has high processing accuracy in via formation by laser and can form vias with high processing accuracy with few laser shots, especially in high energy laser processing by direct laser method. Prepreg. A prepreg obtained by impregnating a glass cloth with a thermosetting resin composition having a glass transition point after curing of 170 to 300 ° C. The thermosetting resin composition contains a polyfunctional epoxy resin, a phenol resin and a thermosetting resin component (A) containing a imidazole curing agent, a phosphoric acid amide compound, and a phosphoric acid ester compound. A flame retardant component (B) and an inorganic filler component (C) containing aluminum hydroxide and silica as essential components are contained as essential components. Moreover, the content rate of the inorganic filler component (C) in the said thermosetting resin composition is 40-80 mass%. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108659204-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108659204-A |
| priorityDate | 2013-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 220.