http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014170848-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83951 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
filingDate | 2013-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0014a1119c9a39af1795c49594cafe4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bd21255082f9018fc327429cc5f9c02 |
publicationDate | 2014-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2014170848-A |
titleOfInvention | Manufacturing method of semiconductor device, sheet-shaped resin composition, and dicing tape-integrated sheet-shaped resin composition |
abstract | PROBLEM TO BE SOLVED: To dissolve a sheet-like resin composition attached to the other surface of a wafer with a support when the support is peeled from a wafer with a support bonded to the wafer and the support through a temporary fixing layer. To provide a method for manufacturing a semiconductor device capable of suppressing the occurrence. SOLUTION: A step of preparing a wafer with a support in which a support is bonded to one surface of a wafer on which a through electrode is formed via a temporary fixing layer; and a sheet-shaped resin composition on a dicing tape. A step B of preparing the formed dicing tape-integrated sheet-shaped resin composition, and a step of attaching the other surface of the wafer with the support to the sheet-shaped resin composition of the dicing tape-integrated sheet-shaped resin composition C, after Step C, Step D for applying an adhesive to the exposed portion of the sheet-shaped resin composition, and Step E for dissolving the temporary fixing layer with a solvent and peeling the support from the wafer. A method for manufacturing a semiconductor device. [Selection] Figure 4 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016125841-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016125841-A1 |
priorityDate | 2013-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 210.