http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014170847-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
filingDate | 2013-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0014a1119c9a39af1795c49594cafe4e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_837f51ca2d7606e381069127d94ef66d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d558f51235128c0066525fc05b80de3d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_feb5c46e949ffc8c3c8a53b81339ab0a |
publicationDate | 2014-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2014170847-A |
titleOfInvention | Manufacturing method of semiconductor device, sheet-shaped resin composition, and dicing tape-integrated sheet-shaped resin composition |
abstract | PROBLEM TO BE SOLVED: To dissolve a sheet-like resin composition attached to the other surface of a wafer with a support when the support is peeled from a wafer with a support bonded to the wafer and the support through a temporary fixing layer. To provide a method for manufacturing a semiconductor device capable of suppressing the occurrence. A process of preparing a wafer with a support in which a support is bonded to one surface of a wafer on which a through electrode is formed via a temporary fixing layer, a dicing tape, and a dicing tape laminated on a central portion of the dicing tape Preparing a dicing tape-integrated sheet-shaped resin composition having a sheet-shaped resin composition prepared and a barrier layer laminated in a region outside the central portion of the dicing tape, the other of the wafer with a support A semiconductor comprising: a process C for attaching the surface to the sheet-shaped resin composition of the dicing tape-integrated sheet-shaped resin composition; and a process D for dissolving the temporary fixing layer with a solvent and peeling the support from the wafer. Device manufacturing method. [Selection] Figure 3 |
priorityDate | 2013-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 206.