| abstract |
An electronic device having a suitable flexible substrate is provided. According to one embodiment, a semiconductor die is formed into a flexible substrate using a pressure activated adhesive, despite the non-planarity of the surface of the semiconductor die or the non-coplanarity of the semiconductor die contact. Directly glued. According to certain embodiments, the one or more semiconductor dies are flexible and / or deformable substrates using a pressure sensitive adhesive (eg, ACA) without the use of intervening stud steps or similar structures. Attached to. The substrate locally yields to compressive forces and can form mechanically strong and conductive connections to the semiconductor die contacts despite the non-coplanarity of the contacts. [Selection] Figure 2 |