http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014156543-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1837840b0d7f1d216335a0331a4bd15a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5415 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2013-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87a170967f8b846ce8ab0ecd5da4adc6 |
| publicationDate | 2014-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014156543-A |
| titleOfInvention | Curable composition for sealing electronic parts and cured product thereof |
| abstract | 【the purpose】 An object of the present invention is to provide a curable composition for encapsulating electronic components with reduced environmental burden and excellent cured physical properties, and a cured product thereof. [Solution] A curable composition for encapsulating an electronic component containing a polymerized rosin epoxy compound having a specific structure as an essential component, and a cured product thereof are used. [Selection figure] None |
| priorityDate | 2013-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 171.