| abstract |
A semiconductor device having a thermosetting insulating resin layer and a metal layer, in which a semiconductor chip is sealed with a resin, can be more efficiently manufactured, and a large area can be collectively sealed or packaged. Provided is a method for manufacturing a semiconductor device, which can be easily reduced in thickness and can further reduce the warpage and stress of a package. A step of preparing a laminated body in which a metal layer, a thermosetting insulating resin layer, a lead frame, and a semiconductor chip are laminated in this order, and a semiconductor of the laminated body Step B for disposing the thermosetting resin sheet 30 on the surface on which the chip 16 is exposed, Step C for embedding the semiconductor chip 16 in at least the thermosetting resin sheet 30, and the insulating resin layer 12 and thermosetting The manufacturing method of the semiconductor device 40 which comprises the process D which thermosets the resin sheet 30. FIG. [Selection] Figure 5 |