| abstract |
A copper paste composition and use thereof in a method of forming a copper conductor on a substrate. The present invention is selected from the group consisting of copper powder, Pb-free, Bi-free, Cd-free borosilicate glass frit, ruthenium-based powder, copper oxide powder, and mixtures thereof. And a copper thick film paste composition paste comprising an organic medium. The present invention also provides a method of using a copper thick film paste composition for producing a copper conductor on a substrate. A typical substrate is selected from the group consisting of aluminum nitride, aluminum oxide and silicon nitride. [Selection] Figure 1 |