abstract |
A resin composition having excellent long-term adhesion reliability of a resin composition and excellent circuit embedding has been provided. A resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the (A) epoxy resin contains a silsesquioxane-modified epoxy resin, The resin composition whose content of this silsesquioxane modified epoxy resin is 0.1-5 mass% when the non-volatile component in the said resin composition is 100 mass%. [Selection figure] None |