| abstract |
The present invention provides a film-like circuit connection material that is excellent in insulation and can be secured by a sensor while reducing connection resistance between circuit electrodes, and a circuit connection structure using the film-like circuit connection material. A film circuit connecting material 1 having an adhesive layer 61 interposed between opposing circuit electrodes to electrically connect the circuit electrodes. An adhesive layer 61 covers (a) a thermoplastic resin, (b) a curable material, (c) a curing agent, and (d) an adhesive component 3 containing a dye, a plastic core, and the plastic core. And an outermost layer of the metal layer is a metal plating containing at least one selected from the group consisting of Ni, Ni alloy and Ni oxide, and has an average particle size of 2.0 to 3.5 μm And conductive particles 5. [Selection] Figure 1 |