| abstract |
Disclosed is a curable resin composition that is excellent in both heat resistance and moldability after curing. SOLUTION: (A) An epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) a maleimide compound are contained, and (C) the curing accelerator is represented by the following general formula (I-1) The curable resin composition containing the compound shown by this. (In Formula (I-1), R 1 to R 3 are each independently a hydrocarbon group having 1 to 18 carbon atoms, and at least one of R 1 to R 3 is a fatty acid having 1 to 18 carbon atoms. 2 or more of R 1 to R 3 may be bonded to each other to form a cyclic structure, and R 4 to R 7 are each independently a hydrogen atom, a hydroxyl group or a carbon number of 1 -18 organic groups, and two or more of R 4 to R 7 may be bonded to each other to form a cyclic structure.) [Selection figure] None |