| abstract |
The target material of a workpiece is altered on a laser basis while improving processing throughput and / or quality. A laser pulse is focused and guided to a region of the workpiece with a sufficiently high pulse repetition rate, thus effectively removing material from this region, preferably in this region, in the vicinity of the region, or both The amount of material that is absent is reduced relative to the amount obtained at lower repetition rates. In one embodiment, the ultrashort pulse laser system can include at least one of a fiber amplifier or a fiber laser. Various embodiments are suitable for performing at least one of dicing, cutting, scribing, and feature formation on or in a semiconductor substrate. The workpiece material may also be a metal, inorganic or organic dielectric, or any material to be micromachined using femtosecond and / or picosecond pulses, in some embodiments up to several nanoseconds of pulse width. Can be included. [Selection] Figure 1F |