| abstract |
Provided is a novolak resin having a high dissolution rate in an alkaline developer in addition to heat resistance, which is a characteristic of a phenol resin used for a positive photoresist. A novolak resin represented by the general formula (1). (R 1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R 2 is a hydrogen atom, a phenyl group, or an alkyl group having 1 to 10 carbon atoms) [Selection figure] None |