http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014133831-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2013-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31ddf8ed724fd704f879a457ce56b348 |
| publicationDate | 2014-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014133831-A |
| titleOfInvention | Epoxy resin composition for compression molding and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To suppress warpage of a BGA package and improve reflow resistance and improve the handleability of a composition powder for an epoxy resin composition for compression molding. SOLUTION: The blending ratio of the inorganic filler is 88% by mass or more of the entire composition, the ratio of triphenylmethane phenol in the curing agent is 70% by mass or more, and the particle size distribution of the powder of the composition is 2.4 mm. The above is 2 mass% or less, and 0.2 mm or less is 5 mass% or less. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017003087-A1 |
| priorityDate | 2013-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.