| abstract |
PROBLEM TO BE SOLVED: To provide a temporary support for a member to be processed with a high adhesive force even at a high temperature (for example, 100 ° C.) when the member to be processed (semiconductor wafer, etc.) is mechanically or chemically treated. Furthermore, a temporary adhesive for manufacturing a semiconductor device that can easily release the temporary support for the processed member without damaging the processed member even after undergoing a process at a high temperature, and the same are used. An adhesive support and a method for manufacturing a semiconductor device are provided. (A) A radically polymerizable monomer having an alicyclic skeleton, (B) a polymer compound, (C) a temporary adhesive for manufacturing a semiconductor device containing a radical polymerization initiator, and adhesion using the same Support and semiconductor device manufacturing method. [Selection] Figure 1 |