http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014107512-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate | 2012-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3dd27d90cd904afa12044f3f6a68304 |
| publicationDate | 2014-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014107512-A |
| titleOfInvention | Lead frame manufacturing method |
| abstract | A lead frame manufacturing method capable of forming a silver pad electrode layer with good dimensional accuracy using an ink jet method is provided. A lead frame comprising a metal substrate, comprising a die pad portion 1a, an inner lead portion 1b, and an outer lead portion 1c, wherein a copper strike plating layer 2 is formed on one surface of the inner lead portion. A base material 1 for coating, and a coating step of forming a silver pad electrode layer 3 by applying a silver nano ink 31 on the copper strike plating layer using an inkjet method. In the coating step, the silver nano ink The silver pad electrode layer is formed by applying the silver nano ink under application conditions in which the surface tension is in the range of 24 mN / m to 38 mN / m and the flight speed of the silver nano ink is in the range of 3 m / s to 20 m / s. A method for manufacturing a lead frame, comprising: forming a lead frame. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10074926-B2 |
| priorityDate | 2012-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.