| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2012-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43865c420f84df6cbbea8f7b0d053979
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b91d7aa115cbbb2b8c323a997c275a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8c56d312e2a003c6452bf9d089744a9 |
| publicationDate |
2014-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2014103257-A |
| titleOfInvention |
Manufacturing method of electronic component device and electronic component device |
| abstract |
PROBLEM TO BE SOLVED: To provide an electronic component device capable of overmolding and underfilling using a sheet-like thermosetting resin composition without being limited by the size of the electronic component or the gap width between the electronic component and the mounting substrate. Providing a manufacturing method of SOLUTION: A step of preparing a mounting substrate in which electronic components are face-down connected, a step of arranging a sheet-like thermosetting resin composition on the electronic component to obtain a laminate, and the laminate in a reduced pressure state. The manufacturing method of the electronic component apparatus including the process of pressing in the chamber of this, and the process of pressurizing the laminated body after a press in the chamber of a high voltage | pressure state. [Selection] Figure 7 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160059964-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016100389-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016054211-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7322998-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10074582-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102372595-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106796922-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016035577-A1 |
| priorityDate |
2012-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |