http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014101561-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_758994071efb42b565fc2c04637be131 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 |
| filingDate | 2012-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a708a8ca0f3c46d3e3568539a0740ff9 |
| publicationDate | 2014-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014101561-A |
| titleOfInvention | Etching solution for copper or copper alloy |
| abstract | PROBLEM TO BE SOLVED: To etch copper or a copper alloy from an electronic substrate having a layer made of copper or a copper alloy and a layer made of nickel, or an electronic substrate having a layer made of copper or a copper alloy and a layer made of tin or a tin alloy. It is an object of the present invention to provide a highly stable etching solution that is less bubbled during use and capable of highly selectively etching copper or a copper alloy. An electronic substrate having a layer made of copper or a copper alloy and a layer made of nickel, or an electronic substrate having a layer made of copper or a copper alloy and a layer made of tin or a tin alloy, and made of copper or a copper alloy An etching solution for a step of selectively etching a layer, which is an etching solution for copper or copper alloy containing an amine (A) having an alkyleneoxy group as an essential component, is used. [Selection] Figure 4 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113015823-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113015823-A |
| priorityDate | 2012-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 132.