http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014095144-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34
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filingDate 2013-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d485e62435e702e4687725910e3e46be
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce28c30b4643c62fdf2f0595a40e39d3
publicationDate 2014-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2014095144-A
titleOfInvention Sputtering target
abstract Disclosed is a sputtering target that can suppress generation of abnormal discharge, nodules, and particles, can produce an oxide semiconductor film having a small S value, excellent TFT reliability, and high mobility. SOLUTION: An oxide including an In element, a Ga element, and a Zn element, and having at least a homologous phase represented by In 2 Ga 2 ZnO 7 as a crystalline phase, a homologous phase represented by InGaZnO 4 , and In 2 O 3. The sputtering target containing the sintered compact in which the intensity | strength of each said crystal phase obtained by X-ray-diffraction measurement satisfy | fills following formula (1-1) and (1-2) is included including the bixbite phase represented by these. (In the formula, I (X) represents the strength of the crystal phase of X.) I (In 2 Ga 2 ZnO 7 )> I (InGaZnO 4 ) (1-1) I (In 2 Ga 2 ZnO 7 )> I (In 2 O 3 ) (1-2) [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113195434-B
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015129468-A1
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priorityDate 2012-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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