| abstract |
Provided is a solid pre-coating underfill material that is excellent in workability, has a high degree of freedom in a solder joint process, and enables formation of a highly reliable solder joint. An underfill composition of the present disclosure includes a curable epoxy resin and has a viscosity at 30 ° C. of 1000 Pa · s or more. The curable epoxy resin contains 50% by mass or more of the crystalline epoxy resin based on the total resin components. [Selection] Figure 1 |