| abstract |
A wiring board having high reliability and a method for manufacturing the wiring board are provided. A wiring board penetrates an interlayer insulating layer 39a, a conductor layer 37c formed on the interlayer insulating layer 39a, a solder resist layer 40a provided on the interlayer insulating layer 39a, and the solder resist layer 40a. The wiring structure 10 having the insulating layer 120 and the conductor pattern 111 on the insulating layer 120 disposed at the position where the opening 40c is formed, the opening 40c formed in the solder resist layer 40a, and the opening 40c. And comprising. The width of the conductor pattern 111 is smaller than the width of the conductor pattern formed on the conductor layer 37c. [Selection] Figure 7N |