| abstract |
PROBLEM TO BE SOLVED: To temporarily support a member to be processed with a high adhesive force even at a high temperature (for example, 100 ° C.) when subjecting the member to be processed (semiconductor wafer or the like) to a temporary support at a high temperature. In addition, the temporary adhesive for manufacturing a semiconductor device, which can reduce the problem that the adhesive generates gas, and can easily release the temporary support to the processed member without damaging the processed member, and An adhesive support using the above and a method for manufacturing a semiconductor device are provided. A temporary adhesive for manufacturing a semiconductor device, which contains (A) a polymer compound having a thermal decomposition start temperature of 250 ° C. or higher, and (B) a radical polymerizable monomer, and an adhesive support using the same. Body and method for manufacturing semiconductor device. [Selection] Figure 1 |