| abstract |
A rheology suitable for a desired printing method, capable of forming a dense conductive film with extremely high conductivity and excellent solder heat resistance without reducing adhesiveness and film strength. To provide a thermosetting conductive paste having characteristics. (A) a polyester resin, (B) an amino resin, (C) a curing catalyst, and (D) metal fine particles having a center particle diameter of 10 nm to 30 μm as essential components, (E) a silane coupling agent, (F A thermosetting resin composition containing at least one selected from the group consisting of a dispersant) and a surfactant (G) is used. [Selection figure] None |