| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2b64c35abf689a3a032c90afaddb107c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-54 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 |
| filingDate |
2013-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0437058c7d0e088a889a7d2978e86036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd956a5c2f12a25f50342171b783553d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_599a649e4b0a6f5629e6fbd56180cfd0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4bf1e9ff6d6153c7ca0eaf3670e86875 |
| publicationDate |
2014-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2014080021-A |
| titleOfInvention |
Flexible copper clad laminate |
| abstract |
A flexible copper-clad laminate having excellent bending resistance, which can prevent disconnection and cracking of a wiring circuit even in a narrow housing. A polyimide layer (A) having a thickness of 10 to 25 μm and a tensile elastic modulus of 4 to 10 GPa has a thickness of 8 to 20 μm, a tensile elastic modulus of 10 to 20 GPa, and a thickness direction. A flexible copper-clad laminate used for a flexible circuit board having a copper foil (B) having an average crystal grain size of 10 μm or more in a cross-section and being folded and housed in a casing of an electronic device, A flexible circuit board that has copper wiring formed by wiring circuit processing, and the bending coefficient [PF] calculated by the following formula (I) in the bending test with a gap of 0.3 mm is in the range of 0.96 ± 0.02. It is a copper clad laminate. (In formula (I), | ε | is the absolute value of the bending average strain value of the copper wiring, and e C is the tensile elastic limit strain of the copper wiring.) [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210001986-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014141083-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180114532-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016060138-A |
| priorityDate |
2012-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |