| abstract |
A resin composition capable of forming a resin layer having excellent electrical conductivity and hardness is provided. A resin composition comprising a compound represented by the following general formula (1), a binder resin, silica fine particles, and a solvent. In the general formula (1), X 1 , X 2 and X 3 are any one selected from the group consisting of OCH 3 , OCH 2 CH 3 , H, CH 3 , OCOCR═CH 2 , OH and COOH. Represents a functional group. [Selection figure] None |