| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00 |
| filingDate |
2012-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7f343bafb31fb269cc585c1a8032d58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc858c749c9ec03da2eaecd53626e43b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f4880606cdaf0fd6c05c1635d3be5ac |
| publicationDate |
2014-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2014072452-A |
| titleOfInvention |
A temporary bonding layer for manufacturing a semiconductor device, a laminate, and a method for manufacturing a semiconductor device. |
| abstract |
PROBLEM TO BE SOLVED: To securely and easily temporarily support a member to be processed when a member to be processed (semiconductor wafer or the like) is subjected to a mechanical or chemical treatment and to treat the member without damaging the member to be processed A temporary bonding layer for manufacturing a semiconductor device, a stacked body, and a method for manufacturing a semiconductor device are provided. A temporary joining layer for manufacturing a semiconductor device having (A) a release layer and (B) an adhesive layer, wherein the release layer is a layer containing a binder and a filler. layer. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017531925-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102554020-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170067819-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107004569-A |
| priorityDate |
2012-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |