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filingDate 2012-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd58c0d8ef0d41787a48f6ffa4ac7844
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publicationDate 2014-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2014058628-A
titleOfInvention Phenolic resin molding materials, molded products and electrical and electronic parts
abstract [PROBLEMS] To provide a phenolic resin molding material capable of obtaining a molded article having flame retardancy and mechanical strength equivalent to those of conventional ones without using halogen, antimony, red phosphorus / organic phosphorus flame retardant. I will provide a. The phenol resin molding material of the present invention contains (A) a phenol resin, (B) a metal hydroxide, (C) an unfired clay, (D) a nitrogen compound, and (E) a heat dissipating filler. Preferably, in 100 parts by mass of the phenol resin molding material, (A) 20 parts by mass or more and 60 parts by mass or less of phenol resin, and (B) 2 parts by mass or more and 20 parts by mass of metal hydroxide. Hereinafter, (C) 1 part by mass or more and 20 parts by mass or less of unfired clay, (D) 0.1 part by mass or more and 10 parts by mass or less of nitrogen compound, (E) 10 parts by mass or more of heat dissipating filler, Contains 80 parts by mass or less. The molded article of the present invention is characterized in that this phenolic resin molding material is molded and cured. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114437497-A
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