Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
filingDate |
2012-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12155e15d49f67c901d87dc7b3c70ae5 |
publicationDate |
2014-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2014056954-A |
titleOfInvention |
Semiconductor device manufacturing method and semiconductor device |
abstract |
A semiconductor device manufacturing method capable of improving productivity and a semiconductor device having a structure capable of improving productivity. A semiconductor device includes a semiconductor element having a connection terminal, a connection terminal that is opposed to the connection terminal of the semiconductor element and that is connected to the connection terminal of the semiconductor element. And a resin layer 15 disposed between the semiconductor substrate 140 of the semiconductor element 14 and the semiconductor substrate 160 of the semiconductor element 16. The semiconductor device 1 has a semiconductor element 16 side surface of the semiconductor element 14 and a surface of the semiconductor element 16 side of the semiconductor element 14 inside the outer surface of the semiconductor substrate 160 of the semiconductor element 16 in a plan view from the stacking direction. The outline of the overlapped area is located. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11664340-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11664352-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11018115-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017120800-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019029672-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11056455-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10153255-B2 |
priorityDate |
2012-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |