http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014055314-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9f6be6dc36ecc0498e0e9fe880e52822 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31 |
| filingDate | 2012-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb294e3beaba28dd36034b80f322ae15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0904952907525e1852f7b3bae9c69893 |
| publicationDate | 2014-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014055314-A |
| titleOfInvention | Self-catalyzed electroless silver plating solution and plating method |
| abstract | To provide a self-catalyzed electroless silver plating solution and a self-catalytic electroless silver plating method capable of selectively and thickly coating only a nickel plating layer formed on a fine pattern of a copper wiring. To do. Selectively silver plating on nickel or nickel-phosphorous on copper circuit wiring comprising a silver salt, a complexing agent and a reducing agent selected from hydroquinone, resorcinol, catechol or pyrogallol. Self-catalyzed electroless silver plating solution. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105986254-A |
| priorityDate | 2012-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 77.