http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014055237-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-548 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2012-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ad1db9ce33169853d36441c650ed4e4 |
| publicationDate | 2014-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014055237-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | [PROBLEMS] To provide an epoxy resin composition for semiconductor encapsulation capable of improving adhesion, excellent heat resistance reliability, and ensuring moldability in a resin composition for semiconductor encapsulation of a lead frame type semiconductor device. A semiconductor device is provided. In an epoxy resin composition for semiconductor encapsulation containing an epoxy resin, a phenol resin curing agent, an inorganic filler, and a silane coupling agent as essential components, 3-octanoylthio-1-propyl is used as the silane coupling agent. It is characterized by containing triethoxysilane. [Selection figure] None |
| priorityDate | 2012-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 112.