| abstract |
An electronic device having excellent heat dissipation efficiency of a heat generating component and capable of suppressing a local increase in the surface temperature of a storage body can be provided. An electronic device includes a housing, a circuit board, and a heat conductive sheet. A circuit board P is attached inside the housing 40. On the circuit board P, electronic components 50, 51, 52, and 53 are mounted, and metal cases 61 and 62 are attached. The heat conductive sheet 101 includes enclosing portions 110, 111, and 112 and a flat portion 120. In the heat conductive sheet 101, the enclosing portions 110, 111, and 112 protrude from the flat portion 120 to the circuit board P side. The surface on the circuit board P side of the enclosing portions 110, 111, and 112 is bonded to the electronic component 51 and the metal cases 61 and 62. Further, the surface of the heat conductive sheet 101 opposite to the circuit board P is bonded to the inner surface of the housing 40. [Selection] Figure 1 |