http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014049191-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee1c19da359446fb5c4f0458a57b783d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 |
| filingDate | 2012-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0d3a4cdf0759f56fd34a72e78b29085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53a8fffaa1887c21f6f73e3c2d246284 |
| publicationDate | 2014-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2014049191-A |
| titleOfInvention | Conductive paste and substrate with conductive film |
| abstract | Provided are a conductive paste capable of forming a conductive film having good conductivity and excellent durability, and a substrate with a conductive film formed using such a conductive paste. A conductive paste containing (A) copper particles, (B) modified dimethylsiloxane, and (C) a binder resin made of a thermosetting resin containing formaldehyde as a component, the copper paste When the major axis is a radial direction in which the Feret diameter of the copper particle is the maximum value and the minor axis is an axis perpendicular to the major axis, the grain is a Feret diameter in the major axis direction and the Feret in the minor axis direction. When the average value of the diameter is the particle diameter of the copper particles, the average value of the particle diameter of the copper particles is 1.0 to 15 μm, the particle diameter of the copper particles, and the thickness of the copper particles The average value of the ratio (average particle size / thickness value) is 2 to 10, flat copper particles, and the copper paste of component (A) is 78 to 94. 99% by mass, 5-20% by mass of the binder resin of component (C), B) A conductive paste containing 0.01 to 2% by mass of a modified dimethylsiloxane as a component. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106169318-A |
| priorityDate | 2012-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.